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U2761B
DECT RF / IF IC
Description
The U2761B is an integrated circuit manufactured in Atmel Wireless & Microcontrollers' UHF5S technology, designed for DECT application. It contains rejection mixer, IF amplifier, FM demodulator working at f = fIF/2, baseband filter, RSSI, TX preamplifier and power-ramping generator for power amplifier.
Features
D Supply-voltage range 2.7 V to 4.7 V D Low current consumption D Few external components D On-chip baseband filter D LO switch and TX preamplifier D Ramp-signal generator for power amplifier
Block Diagram
QUAD_TANK2 IF_TANK1 IF_TANK2 QUAD_TANK1 DEMOD_OUT VS1 VS2
IF_IN1 IF_IN2
IF amp 1
IF amp 2
Demodulator Bandgap
MIXER_IN1 MIXER_IN2
IR mixer
T/R switch
TX driver TX_RF_OUT
Ramp generator
Control logic
OpAmp + - OP_OUT
MIXER_OUT1
RAMP_SET TX_ON MIXER_OUT2 RAMP_OUT
RX_ON LO_IN2 OP_N LO_IN1 OP_P
14657
Figure 1. Block diagram
Ordering Information
Extended Type Number U2761B-MFS U2761B-MFSG3 SSO28 SSO28 Package Tube Taped and reeled Remarks
Rev. A6, 17-Aug-00
1 (11)
Preliminary Information
U2761B
Pin Description
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1 2 3 4 5 6 7 8 9 RSSI PU Received signal strength indicator output Hardware power-up input IF tank circuit Pin 1 IF tank circuit Pin 2 Ground IF_TANK1 IF_TANK2 GND1 MIXER_IN1 MIXER_IN2 GND2 Mixer RF differential input 1 Mixer RF differential input 2 Ground TX_RF_OUT VS1 Output of TX driver amplifier Supply voltage input 1 10 11 IF_IN1 IF_IN2 IF amplifier differential input 1 IF amplifier differential input 2 Ramp-signal output for PA Slew-rate setting of ramp signal RX control input TX control input 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 RAMP_OUT RAMP_SET RX_ON TX_ON MIXER_OUT1 MIXER_OUT2 VS2 Mixer IF differential output 1 Mixer IF differential output 2 Supply voltage input 2 LO_IN1 LO_IN2 GND3 Local oscillator input 1 Local oscillator input 2 Ground QUAD_TANK1 QUAD_TANK2 DEMOD_OUT OP_N OP_P Quadrature tank circuit 1 Quadrature tank circuit 2 Output of demodulator OP - Input inverting OP - Input non-inverting OP - Output OP_OUT
Pin
Symbol
Function
RSSI PU
1 2
28 OP_OUT 27 OP_P 26 OP_N
IF_TANK1 3 IF_TANK2 4 GND1 5
25 DEMOD_OUT 24 QUAD_TANK2 23 QUAD_TANK1 22 GND3 21 LO_IN2
MIXER_IN1 6 MIXER_IN2 7 GND2 8 TX_RF_OUT 9 VS1 10 IF_IN1 11 IF_IN2 12 RAMP_OUT 13 RAMP_SET 14
U2761B
20 LO_IN1 19 VS2
18 MIXER_OUT2 17 MIXER_OUT1
16 TX_ON 15 RX_ON
Figure 2. Pinning
2 (11)
Rev. A6, 17-Aug-00
Preliminary Information
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Rev. A6, 17-Aug-00 Isolation LO-TX Input matching Input impedance Power gain (high) Input matching Input impedance Conversion gain DSB noise figure IR mixer Power supply Supply voltage Junction ambient Supply voltage Test conditions: VS = 3.0 V, Tamb = 25C, unless otherwise specified
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Electrical Characteristics
All voltages refer to GND (Pins 5, 8 and 22)
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Thermal Resistance
All voltages refer to GND (Pins 5, 8 and 22)
Operating Range
Absolute Maximum Ratings
LO switch and TX driver
Output interception point
Image-rejection ratio
Total supply current pp y
Ambient temperature
Storage temperature
Junction temperature
Parameter
Parameter
Parameter
Parameter
Pins 10 and 19
Pins 10 and 19
RX mode: LO Pin 20 or Pin 21 to Pin 9
Pin 20 or Pin 21 to GND
@ Pin = -40 dBm
Rload = 200 W
Standby, PU = GND
RX (RSSI only)
RX
TX
Pins 6, 7, 17 and 18
Pin 9, 20 and 21
Preliminary Information
Test Conditions / Pins Pins 17 and 18 Pins 17 and 18 Pins 17 and 18 Pins 20 and 21 Pins 6 and 7 Pins 6 and 7 Symbol Symbol RthJA Symbol Tstg VS Tj Tamb VS NFDSB= NFSSB Gconv VSWRin VSWRin Symbol OIP3 IRR Isol Zin Zin Gp IS Min. -25 2.7 Min. -40 to +125 Value Value 130 150 5.0 Typ. +25 3.0 Typ. <2:1 <2:1 37 50 30 50 10 12 10 20 47 50 30 1
U2761B
Max.
Max.
+85
4.7
10
K/W
Unit
Unit
C
C
V
Unit
dBm
Unit
mA
mA
mA
3 (11) C mA dB dB dB dB dB V W W
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Test conditions: VS = 3.0 V, Tamb = 25C, unless otherwise specified
Electrical Characteristics (continued)
U2761B
4 (11) Open-loop gain Input offset voltage Excess phase Power gain bandwidth OpAmp AM rejection ratio Output impedance Amplitude of recovered signal Output-voltage DC range Sensitivity Co-channel rejection ratio FM demodulator Max. output current Quiescent output current RSSI fall time RSSI rise time RSSI resolution RSSI dynamic range RSSI compression RSSI sensitivity RSSI Bandwidth of external tank circuit Noise figure Power gain Upper cut-off frequency Lower cut-off frequency Input impedance IF amplifier Output interception point Gain compression Maximum output power Output impedance Parameter @ Pin = -75 dBm at IR-mixer input Rload = 1 kW, Cload = 15 pF Quality factor of external tank circuit approx. 20, fres = fIF/2 Nominal deviation of signal 288 kHz Pin 25 @ Pin = 100 dBmV at IF_IN1, IF_IN2 Pin 1 @ Pin < 20 dBmV at IF_IN1, IF_IN2 Pin 1 Pin = 100 dBmV to 30 dBmV, Pin 1 Pin = 30 dBmV to 100 dBmV, Pin 1 Slope of the RSSI has to be steady At IF_IN1, IF_IN2, At IF_IN1, IF_IN2, @ TX_RF_OUT Pins 26, 27 and 28 Pins 23, 24 and 25 Pins 1, 6 and 7 Pins 3, 4, 11 and 12 Test Conditions / Pins Pins 11 and 12 Pins 26 and 27 Pins 3 and 4 Pin 25 Pin 25 Pin 9 Pin 9 Pin 9 Pin 9 Pins 6 and 7 Pins 6 and 7 FMoutDC Symbol BW3dB AMRR PGBW CCRR fu3dB OIP3 fl3dB Pmax Pmax P1dB Voffs Pmin Zout Acc Zout DR Iout Iout NF Zin Gp A S tf tr g d Min. 200 0.4 Typ. 288 150 100 130 100 1 tbd 0.5 2 70 80 10 13 10 30 80 20 10 85 90 10 1 1 9 1 3
Preliminary Information
Rev. A6, 17-Aug-00 VS - 0.4 Max. 400 V/MHz dBmV dBmV mVss MHz MHz MHz MHz dBm dBm dBm Unit mV kW mA mA dB dB dB dB dB dB ms ms W W V dB
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Active Blocks Corresponding to RX / TX
Settling time VS = 0 -> active operation Settling time standby -> active operation Settling time active operation -> standby Power-up high input current Standby low input current Standby low input level Power-up high input level Power / standby Low input current High input current Low input level High input level Logic input levels (RX_ON, TX_ON) Fall time Rise time Max. output voltage Min. output voltage Ramp generator Common mode input voltage Common mode rejection ratio Total harmonic distortion Output-voltage range Switched VS = 0 to VS = 3 V Switched PU = 0 to PU = 1 Switched VS = 3 V to VS = 0 PU = `0' PU = `1' PU = `0' PU = `1' = `0' = `1' = `0' = `1' CRAMP = 270 pF at Pin 14 CRAMP = 270 pF at Pin 14 Accord. to PA RAMP input Accord. to PA RAMP input Pins 13 and 14 Pin 2 Pins 15 and 16 Pins 26 and 27 VPU = 3 V, VPU = 4.6 V VPU = 0 V, VPU = 0.5 V Pin 28 Pin 28 Pin 28 VPU,OFF IPU,OFF CMRR Vmax THD Vmin VPU Vout ViH tsoa IPU ViL Vin tsas tssa IiL IiH tf tr 2.0 1.5 0.3 0.3 20 40 -5 -5 t.b.d. t.b.d. < 10 < 10 1.95AAAA V <2 0.2 30 60 5 5 VS - 0.3 VS - 0.3 40 80 0.1 1 0.7 0.5 5 5 A A A A dB s s s s s % V V V V V V V
Rev. A6, 17-Aug-00 Test conditions: VS = 3.0 V, Tamb = 25C, unless otherwise specified
Electrical Characteristics (continued)
RX mode
TX mode
Standby
RSSI
Parameter
PU
1
0
1
1
1
RX_ON
X
0
1
1
0
Logic
TX_ON
X
0
1
0
1
OP
off
off
off
off
on
Preliminary Information
Test Conditions / Pins
Demodulator off off off off on IF amplifiers off off off on on IR mixer off off off on on Active Parts RSSI
Symbol
off
off
off
on
on
RX switch
off
off
off
on
on
Min.
TX switch
Typ.
off
off
off
on
on
U2761B
TX driver
Max.
off
off
off
off
on
Ramp generator
Unit
5 (11)
off off off off on
U2761B
Typical Application Circuit
RX_ON TX_ON LO_IN
LC-tank RX_DATA
PCB
28
27
26
25
24
23
22
21
20
19
18
17
16
15 Matching + balun
+ OP amp
- Demodulator
RX
TX
Control- logic LC
TX driver IF amp 2 IR mixer IF amp 1 Ramp generator
SAW Filter
RF/IF U2761B 1 RSSI PU LC-Tank MIXER_IN TX_RF_OUT 2 3 4 5 6 7 8 9 10 11 12
Matching + balun
13
14 VS
RAMP_OUT
14658
Figure 3. Typical application circuit
Recommended Baseband Filter (f3dB [ 570 kHz)
14659
26
-
25 R3 6.8k R1 13k C1 18p C2 5.6p 27
28
+
Figure 4. Recommended baseband filter
6 (11)
Rev. A6, 17-Aug-00
Preliminary Information
U2761B
Input / Output Interface Circuits
VS VS
2 1 RSSI PU
25k
25k
14660
14661
Figure 5.
Figure 8.
VS
VS
3 IF_TANK1
4 IF_TANK2
6 MIXER_IN1
7 MIXER_IN2
14662
Figure 6.
Figure 9.
VS
9 11 TX_RF_OUT IF_IN1 IF_IN2 4.3k 12
14665
Figure 7.
Figure 10.
Rev. A6, 17-Aug-00
7 (11)
Preliminary Information
U2761B
Input / Output Interface Circuits (continued)
19 VS2 VS1 10 VS
AB- control
22 GND3 8 GND2 GND1
14666
13, 28 RAMP_OUT OP_OUT
5
14667
Figure 11.
Figure 14.
VS
VS
14 RAMP_SET 15, 16 TX_ON RX_ON 5k 5k
14668
14669
Figure 12.
Figure 15.
VS
VS
10k 24 QUAD_TANK2
10k 23 QUAD_TANK1
20 LO_IN1 200 200
21 LO_IN2
14670
Figure 13.
Figure 16.
8 (11)
Rev. A6, 17-Aug-00
Preliminary Information
U2761B
Input / Output Interface Circuits (continued)
VS
VS
17
18 MIXER_OUT2
25 DEMOD_OUT
MIXER_OUT1
14672
Figure 17.
Figure 19.
VS
26 OP_N
27 OP_P
14673
Figure 18.
Rev. A6, 17-Aug-00
9 (11)
Preliminary Information
U2761B
Package Information
Package SSO28
Dimensions in mm
9.10 9.01 5.7 5.3 4.5 4.3
1.30 0.25 0.65 8.45 28 15 0.15 0.05 6.6 6.3 0.15
technical drawings according to DIN specifications
13018
1
14
10 (11)
Rev. A6, 17-Aug-00
Preliminary Information
U2761B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. TEMIC Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
1.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify TEMIC Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Data sheets can also be retrieved from the Internet: http://www.temic-semi.com
TEMIC Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2594, Fax number: 49 (0)7131 67 2423
Rev. A6, 17-Aug-00
11 (11)
Preliminary Information

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